Assignee
ARS ELECTRONICS CO LTD
JP·2 granted patents·62 citations·filing 2001–2003
Top patents by PatentIndex Score
2 records- 0177US6566747B2Semiconductor package and production method thereofARS ELECTRONICS CO LTD·Filed 2001·Granted May 20, 2003·44 cites·5 claims
- 0264US6724083B2Method of producing semiconductor packages by cutting via holes into half when separating substrateARS ELECTRONICS CO LTD·Filed 2003·Granted Apr 20, 2004·18 cites·4 claims
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