Assignee
ANDERSEN LAB INC
US·3 granted patents·61 citations·filing 1999–2000
Top patents by PatentIndex Score
3 records- 0163US6287894B1Acoustic device packaged at wafer levelANDERSEN LAB INC·Filed 1999·Granted Sep 11, 2001·38 cites·14 claims
- 0256US6182342B1Method of encapsulating a saw deviceANDERSEN LAB INC·Filed 1999·Granted Feb 6, 2001·18 cites·9 claims
- 0351US6285114B1Encapsulation technology for saw deviceANDERSEN LAB INC·Filed 2000·Granted Sep 4, 2001·5 cites·8 claims
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