Assignee

ADVANCED MATERIALS SCIENCES IN

US·1 granted patent·6 citations·filing 2003–2003

Technology mixB24B1 H10P1 Y10T1

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0151US7186629B2Protecting thin semiconductor wafers during back-grinding in high-volume productionADVANCED MATERIALS SCIENCES IN·Filed 2003·Granted Mar 6, 2007·6 cites·28 claims

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