Assignee
3DIS TECH
FR·2 granted patents·1 citations·filing 2016–2018
Top patents by PatentIndex Score
2 records- 0155US11133264B2Electronic system comprising a lower redistribution layer and method for manufacturing such an electronic system3DIS TECH·Filed 2018·Granted Sep 28, 2021·1 cites·15 claims
- 0222US10438923B2Method for integrating at least one 3D interconnection for the manufacture of an integrated circuit3DIS TECH·Filed 2016·Granted Oct 8, 2019·0 cites·13 claims
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