Assignee
3D PLUS
FR·18 granted patents·4 pending applications·139 citations·filing 2000–2025
Top patents by PatentIndex Score
22 records- 0192US7951649B2Process for the collective fabrication of 3D electronic modules3D PLUS·Filed 2007·Granted May 31, 2011·26 cites·20 claims
- 0287US7877874B2Process for the collective fabrication of 3D electronic modules3D PLUS·Filed 2006·Granted Feb 1, 2011·16 cites·20 claims
- 0383US7476965B2Electronic device with integrated heat distributor3D PLUS·Filed 2005·Granted Jan 13, 2009·19 cites·20 claims
- 0482US6716672B2Three dimensional interconnection method and electronic device obtained by same3D PLUS·Filed 2001·Granted Apr 6, 2004·32 cites·12 claims
- 0580US6809367B2Device for interconnecting, in three dimensions, electronic components3D PLUS·Filed 2000·Granted Oct 26, 2004·28 cites·6 claims
- 0673US10332863B2Method of miniaturized chip on chip interconnection of a 3D electronic module3D PLUS·Filed 2017·Granted Jun 25, 2019·2 cites·12 claims
- 0771US11594972B2Resonant power converter3D PLUS·Filed 2021·Granted Feb 28, 2023·2 cites·6 claims
- 0870US2025266749A1Non-linear analogue control of a multi-phase electrical circuit3D PLUS·Filed 2025·Application pending·0 cites
- 0967US9899250B2Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz3D PLUS·Filed 2017·Granted Feb 20, 2018·1 cites·7 claims
- 1060US8359740B2Process for the wafer-scale fabrication of electronic modules for surface mounting3D PLUS·Filed 2009·Granted Jan 29, 2013·2 cites·7 claims
- 1157US7635639B2Method for the interconnection of active and passive components and resulting thin heterogeneous component3D PLUS·Filed 2004·Granted Dec 22, 2009·9 cites·9 claims
- 1256US2025331096A1Heat sink for a 3d electronic module3D PLUS·Filed 2023·Application pending·0 cites
- 1355US11587911B2Process for producing a high-frequency-compatible electronic module3D PLUS·Filed 2021·Granted Feb 21, 2023·0 cites·7 claims
- 1450US9659846B2Process for manufacturing a 3D electronic module comprising external interconnection leads3D PLUS·Filed 2016·Granted May 23, 2017·1 cites·7 claims
- 1549US10466097B23D imaging optoelectronic module3D PLUS·Filed 2017·Granted Nov 5, 2019·1 cites·7 claims
- 1645US12586708B2Innovative planar electromagnetic component structure3D PLUS·Filed 2022·Granted Mar 24, 2026·0 cites·4 claims
- 1744US8716036B2Method for collective fabrication of 3D electronic modules comprising only validated PCBs3D PLUS·Filed 2012·Granted May 6, 2014·0 cites·6 claims
- 1843US10064278B23D electronic module comprising a ball grid array stack3D PLUS·Filed 2016·Granted Aug 28, 2018·0 cites·9 claims
- 1942US2021040620A1Process for metallizing holes of an electronic module by liquid-phase deposition3D PLUS·Filed 2019·Application pending·0 cites
- 2036US2018061731A1Electronic chip device with improved thermal resistance and associated manufacturing process3D PLUS·Filed 2016·Application pending·0 cites
- 2133US11067621B2Apparatus for burning in electronic components3D PLUS·Filed 2019·Granted Jul 20, 2021·0 cites·3 claims
- 2230US10727748B2High frequency DC voltage converter of the quasi-resonant buck type3D PLUS·Filed 2017·Granted Jul 28, 2020·0 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when 3D PLUS files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →