Assignee
WSTP LLC
US·5 granted patents·29 citations·filing 2006–2009
Top patents by PatentIndex Score
5 records- 0182US7654432B2Forming solder balls on substratesWSTP LLC·Filed 2008·Granted Feb 2, 2010·7 cites·11 claims
- 0281US7604153B2Forming solder balls on substratesWSTP LLC·Filed 2006·Granted Oct 20, 2009·11 cites·11 claims
- 0379US7837083B2Forming solder balls on substratesWSTP LLC·Filed 2009·Granted Nov 23, 2010·5 cites·11 claims
- 0468US7842599B2Bumping electronic components using transfer substratesWSTP LLC·Filed 2007·Granted Nov 30, 2010·3 cites·5 claims
- 0566US7819301B2Bumping electronic components using transfer substratesWSTP LLC·Filed 2007·Granted Oct 26, 2010·3 cites·11 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →