Assignee
WAVENICS INC
KR·3 granted patents·4 pending applications·23 citations·filing 2006–2010
Top patents by PatentIndex Score
7 records- 0190US8034664B2Method of fabricating passive device applied to the three-dimensional package moduleWAVENICS INC·Filed 2010·Granted Oct 11, 2011·13 cites·5 claims
- 0279US7838380B2Method for manufacturing passive device and semiconductor package using thin metal pieceWAVENICS INC·Filed 2010·Granted Nov 23, 2010·4 cites·7 claims
- 0375US7851918B2Three-dimensional package moduleWAVENICS INC·Filed 2006·Granted Dec 14, 2010·6 cites·10 claims
- 0442US2010326707A1Methal-based package substrate, three-dimensional multi-layered package module using the same, and manufacturing method thereofWAVENICS INC·Filed 2007·Application pending·0 cites
- 0541US2009146168A1High efficiency led with multi-layer reflector structure and method for fabricating the sameWAVENICS INC·Filed 2006·Application pending·0 cites
- 0640US2009175022A1Multi-layer package structure and fabrication method thereofWAVENICS INC·Filed 2006·Application pending·0 cites
- 0740US2011033962A1High efficiency led with multi-layer reflector structure and method for fabricating the sameWAVENICS INC·Filed 2010·Application pending·0 cites
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