Assignee
VAL CHRISTIAN
FR·7 granted patents·43 citations·filing 2006–2012
Top patents by PatentIndex Score
7 records- 0194US8567051B2Process for the vertical interconnection of 3D electronic modules by viasVAL CHRISTIAN·Filed 2008·Granted Oct 29, 2013·28 cites·8 claims
- 0275US8735220B2Method for positioning chips during the production of a reconstituted waferVAL CHRISTIAN·Filed 2010·Granted May 27, 2014·4 cites·8 claims
- 0375US8546190B2Method for positioning chips during the production of a reconstituted waferVAL CHRISTIAN·Filed 2010·Granted Oct 1, 2013·4 cites·13 claims
- 0468US8136237B2Method of interconnecting electronic wafersVAL CHRISTIAN·Filed 2008·Granted Mar 20, 2012·4 cites·10 claims
- 0561US9111688B2Method for producing reconstituted wafers with support of the chips during their encapsulationVAL CHRISTIAN·Filed 2012·Granted Aug 18, 2015·1 cites·4 claims
- 0661US8243468B2Low-thickness electronic module comprising a stack of electronic packages provided with connection ballsVAL CHRISTIAN·Filed 2006·Granted Aug 14, 2012·2 cites·10 claims
- 0741US8264853B23D electronic moduleVAL CHRISTIAN·Filed 2006·Granted Sep 11, 2012·0 cites·26 claims
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