Assignee

TOMONARI MASANORI

JP·1 granted patent·2 citations·filing 2009–2009

Technology mixB01J1 B22F1 B82Y1 C08K1 C09D1 H01B1

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0157US10071419B2Metallic copper dispersion, process for producing the metallic copper dispersion, electrode, wiring pattern, and coating film formed using the metallic copper dispersion, decorative article and antimicrobial article with the coating film formed thereon, and processes for producing the decorative article and the antimicrobial articleTOMONARI MASANORI·Filed 2009·Granted Sep 11, 2018·2 cites·23 claims

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