Assignee
TIAN YONGLAI
US·2 granted patents·1 pending application·15 citations·filing 2005–2011
Top patents by PatentIndex Score
3 records- 0185US8207478B2Method and apparatus for rapid thermal processing and bonding of materials using RF and microwavesTIAN YONGLAI·Filed 2011·Granted Jun 26, 2012·7 cites·15 claims
- 0282US7569800B2Method and apparatus for rapid thermal processing and bonding of materials using RF and microwavesTIAN YONGLAI·Filed 2005·Granted Aug 4, 2009·8 cites·17 claims
- 0356US2009255926A1Method and apparatus for rapid thermal processing and bonding of materials using rf and microwavesTIAN YONGLAI·Filed 2009·Application pending·0 cites
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