Assignee
TEWS DIRK
DE·2 granted patents·3 citations·filing 2006–2010
Top patents by PatentIndex Score
2 records- 0159US8192636B2Composition and method for improved adhesion of polymeric materials to copper alloy surfacesTEWS DIRK·Filed 2006·Granted Jun 5, 2012·3 cites·14 claims
- 0236US8758634B2Composition and method for micro etching of copper and copper alloysTEWS DIRK·Filed 2010·Granted Jun 24, 2014·0 cites·13 claims
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