Assignee
TESSERA RESEARCH LLC
US·2 granted patents·1 pending application·20 citations·filing 2009–2010
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0191US7923851B2Microelectronic assembly with impedance controlled wirebond and conductive reference elementTESSERA RESEARCH LLC·Filed 2010·Granted Apr 12, 2011·15 cites·23 claims
- 0282US8008785B2Microelectronic assembly with joined bond elements having lowered inductanceTESSERA RESEARCH LLC·Filed 2010·Granted Aug 30, 2011·5 cites·37 claims
- 0347US2011147928A1Microelectronic assembly with bond elements having lowered inductanceTESSERA RESEARCH LLC·Filed 2009·Application pending·0 cites
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