Assignee
TERASHIMA SHINICHI
JP·4 granted patents·13 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0185US8742258B2Bonding wire for semiconductorTERASHIMA SHINICHI·Filed 2010·Granted Jun 3, 2014·9 cites·15 claims
- 0272US9296180B2Metal foil for base materialTERASHIMA SHINICHI·Filed 2011·Granted Mar 29, 2016·1 cites·8 claims
- 0367US9024442B2Solder ball for semiconductor packaging and electronic member using the sameTERASHIMA SHINICHI·Filed 2011·Granted May 5, 2015·3 cites·10 claims
- 0450US8097960B2Semiconductor mounting bonding wireTERASHIMA SHINICHI·Filed 2008·Granted Jan 17, 2012·0 cites·17 claims
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