Assignee
TAKAI TOSHIAKI
JP·2 granted patents·2 pending applications·6 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0178US8889441B2Method for manufacturing wafer-bonded semiconductor deviceTAKAI TOSHIAKI·Filed 2010·Granted Nov 18, 2014·6 cites·26 claims
- 0247US8449204B2Optical moduleTAKAI TOSHIAKI·Filed 2009·Granted May 28, 2013·0 cites·17 claims
- 0340US2009180732A1Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical ModuleTAKAI TOSHIAKI·Filed 2008·Application pending·0 cites
- 0436US2014023315A1Optical Module and a Mounting Structure ThereofTAKAI TOSHIAKI·Filed 2011·Application pending·0 cites
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