Assignee

SHI WEN

CN·2 granted patents·6 citations·filing 2007–2008

Technology mixH10P2 G01R1 H10W1

Top patents by PatentIndex Score

2 records

0168US8323990B2Reliability test structure for multilevel interconnectSHI WEN·Filed 2007·Granted Dec 4, 2012·5 cites·19 claims
0256US8164091B2Multi-purpose poly edge test structureSHI WEN·Filed 2008·Granted Apr 24, 2012·1 cites·12 claims

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