Assignee
SAWAMURA KENJI
JP·1 granted patent·2 pending applications·0 citations·filing 2007–2010
Top patents by PatentIndex Score
3 records- 0145US2010001401A1Semiconductor device including interconnect layer made of copperSAWAMURA KENJI·Filed 2009·Application pending·0 cites
- 0241US2007267750A1Semiconductor device including interconnect layer made of copperSAWAMURA KENJI·Filed 2007·Application pending·0 cites
- 0333US8194445B2Semiconductor storage device comprising dot-type charge accumulation portion and control gate, and method of manufacturing the sameSAWAMURA KENJI·Filed 2010·Granted Jun 5, 2012·0 cites·20 claims
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