Assignee
SAKAMOTO HAJIME
JP13 patents
Top patents by PatentIndex Score
US8453323B2Jun 4, 2013
Printed circuit board manufacturing method
SAKAMOTO HAJIME12 citations92
US8186045B2May 29, 2012
Multilayer printed circuit board and multilayer printed circuit board manufacturing method
SAKAMOTO HAJIME14 citations92
US8079142B2Dec 20, 2011
Printed circuit board manufacturing method
SAKAMOTO HAJIME15 citations92
US8067699B2Nov 29, 2011
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME8 citations92
US8959756B2Feb 24, 2015
Method of manufacturing a printed circuit board having an embedded electronic component
SAKAMOTO HAJIME6 citations84
US8822323B2Sep 2, 2014
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME6 citations84
US8524535B2Sep 3, 2013
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME6 citations84
US8438727B2May 14, 2013
Multilayer printed circuit board and multilayer printed circuit board manufacturing method
SAKAMOTO HAJIME2 citations74
US8293579B2Oct 23, 2012
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME4 citations74
US8058563B2Nov 15, 2011
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME4 citations63
US8188378B2May 29, 2012
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME4 citations62
US8997344B2Apr 7, 2015
Method for manufacturing interposer
SAKAMOTO HAJIME0 citations52
US8173907B2May 8, 2012
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME0 citations52