Assignee

PENG WEN-YU

TW·2 granted patents·15 citations·filing 2009–2010

Technology mixF16B1 G05B1 Y10T1

Top patents by PatentIndex Score

2 records

0181US8262308B2Coupling structure for a casingPENG WEN-YU·Filed 2010·Granted Sep 11, 2012·14 cites·7 claims
0249US8169297B2Electronic assembly having means to prevent non-permitted disassembling of its componentsPENG WEN-YU·Filed 2009·Granted May 1, 2012·1 cites·9 claims

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