Assignee

OYAMA MASAAKI

JP·1 granted patent·0 citations·filing 2012–2012

Technology mixH03K1 H10W1

Top patents by PatentIndex Score

1 record

0119US8674756B2Power cut-off technique for semiconductor deviceOYAMA MASAAKI·Filed 2012·Granted Mar 18, 2014·0 cites·6 claims

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