Assignee

OSANAI HIDEYO

JP·2 granted patents·5 citations·filing 2011–2012

Technology mixB22D2 H05K2 H10W2 Y10T2 H01L1

Top patents by PatentIndex Score

2 records

0179US8745841B2Aluminum bonding member and method for producing sameOSANAI HIDEYO·Filed 2012·Granted Jun 10, 2014·5 cites·5 claims
0237US9713253B2Metal/ceramic bonding substrate and method for producing sameOSANAI HIDEYO·Filed 2011·Granted Jul 18, 2017·0 cites·10 claims

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