Assignee

OSAMURA MAKOTO

JP·1 granted patent·5 citations·filing 2009–2009

Technology mixB65D1 G06K1 H01Q1 H10W1

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1 record

0166US8299968B2Packaging material with electromagnetic coupling moduleOSAMURA MAKOTO·Filed 2009·Granted Oct 30, 2012·5 cites·7 claims

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