Assignee
OOYAMA KOOKI
JP·2 granted patents·0 citations·filing 2010–2011
Technology mixB29C2
Top patents by PatentIndex Score
2 records- 0144US8226398B2Apparatus and method for inflation extrusion molding of pressure-sensitive adhesive sheetOOYAMA KOOKI·Filed 2011·Granted Jul 24, 2012·0 cites·2 claims
- 0241US8092204B2Apparatus and method for inflation extrusion molding of pressure-sensitive adhesive sheetOOYAMA KOOKI·Filed 2010·Granted Jan 10, 2012·0 cites·2 claims
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