Assignee
OKA YOSHIO
JP·4 granted patents·1 pending application·7 citations·filing 2005–2010
Top patents by PatentIndex Score
5 records- 0170US8866027B2Printed wiring board and method for manufacturing the sameOKA YOSHIO·Filed 2008·Granted Oct 21, 2014·6 cites·15 claims
- 0254US8309853B2Flexible printed wiring boardOKA YOSHIO·Filed 2008·Granted Nov 13, 2012·1 cites·3 claims
- 0349US2012031656A1Substrate for printed wiring board, printed wiring board, and methods for producing sameOKA YOSHIO·Filed 2010·Application pending·0 cites
- 0443US8617688B2Conductive paste and multilayer printed wiring board using the sameOKA YOSHIO·Filed 2006·Granted Dec 31, 2013·0 cites·6 claims
- 0540US8597459B2Conductive paste and method for manufacturing multilayer printed wiring board using the sameOKA YOSHIO·Filed 2005·Granted Dec 3, 2013·0 cites·4 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →