Assignee
OGAWA SHUN
JP·4 granted patents·1 pending application·5 citations·filing 2006–2010
Top patents by PatentIndex Score
5 records- 0171US8431653B2Curing agent composition for epoxy resins and epoxy resin compositionOGAWA SHUN·Filed 2006·Granted Apr 30, 2013·2 cites·15 claims
- 0261US8394501B2Polyurethane resin compositionOGAWA SHUN·Filed 2008·Granted Mar 12, 2013·3 cites·22 claims
- 0348US2012065327A1Polyamide resinOGAWA SHUN·Filed 2010·Application pending·0 cites
- 0446US8569404B2Polyamide resin composition and molded articleOGAWA SHUN·Filed 2010·Granted Oct 29, 2013·0 cites·20 claims
- 0540US10273359B2Polyamide resin compositionOGAWA SHUN·Filed 2010·Granted Apr 30, 2019·0 cites·21 claims
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