Assignee
OGAWA HISASHI
JP·1 granted patent·3 pending applications·0 citations·filing 2005–2011
Top patents by PatentIndex Score
4 records- 0147US2007034338A1Binding apparatus for binding both ends of an adhesive tape around an objectOGAWA HISASHI·Filed 2005·Application pending·0 cites
- 0242US8258582B2Semiconductor device and method for manufacturing the sameOGAWA HISASHI·Filed 2011·Granted Sep 4, 2012·0 cites·21 claims
- 0333US2007096183A1Semiconductor device and method for fabricating the sameOGAWA HISASHI·Filed 2006·Application pending·0 cites
- 0433US2007108530A1Semiconductor device and method for manufacturing the sameOGAWA HISASHI·Filed 2006·Application pending·0 cites
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