Assignee
MORI MASATO
JP·2 granted patents·22 citations·filing 2007–2007
Top patents by PatentIndex Score
2 records- 0182US8208270B2Substrate joining member and three-dimensional structure using the sameMORI MASATO·Filed 2007·Granted Jun 26, 2012·12 cites·13 claims
- 0281US8159829B2Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrateMORI MASATO·Filed 2007·Granted Apr 17, 2012·10 cites·8 claims
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