Assignee

MDM INC

KR·2 granted patents·2 pending applications·3 citations·filing 2016–2019

Technology mixH05K4

Top patents by PatentIndex Score

4 records

0173US10455697B2PCB module having multi-sided heat sink structure and multilayer PCB assembly for use in sameMDM INC·Filed 2019·Granted Oct 22, 2019·3 cites·15 claims
0241US9930815B2Multi-layer PCB having function of dissipating heat from power semiconductor module package and PCB, and production method thereofMDM INC·Filed 2016·Granted Mar 27, 2018·0 cites·11 claims
0337US2020178396A1Method for forming circuit pattern on surface of three-dimensional structureMDM INC·Filed 2019·Application pending·0 cites
0437US2020178399A1Method for forming multilayered circuit pattern on surface of three-dimensional metal boardMDM INC·Filed 2019·Application pending·0 cites

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →