Assignee
MATSUMURA HIDEYASU
JP·3 granted patents·1 pending application·6 citations·filing 2005–2011
Top patents by PatentIndex Score
4 records- 0179US8486530B2Method for reducing volatile organic compounds in composite resin particles, and composite resin particlesMATSUMURA HIDEYASU·Filed 2010·Granted Jul 16, 2013·2 cites·17 claims
- 0277US8592494B2Styrene-modified linear low-density polyethylene-based resin beads, styrene-modified linear low-density polyethylene-based expandable resin beads, production method therefor, pre-expanded beads and expanded molded articleMATSUMURA HIDEYASU·Filed 2011·Granted Nov 26, 2013·3 cites·6 claims
- 0365US8476325B2Styrene-modified polyethylene-based resin beads, styrene-modified polyethylene-based expandable resin beads, production method therefor, pre-expanded beads and expanded molded articleMATSUMURA HIDEYASU·Filed 2005·Granted Jul 2, 2013·1 cites·5 claims
- 0448US2007243365A1Styrene-Modified Linear Low-Density Polythylene-Based Resin Beads, Styrene-Modified Linear Low-Density Polyethylene-Based Expandable Resin Beads, Production Method Therefor, Pre-Expanded Beads and Expanded Molded ArticleMATSUMURA HIDEYASU·Filed 2005·Application pending·0 cites
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