Assignee
MASUDA NAOMI
JP·5 granted patents·42 citations·filing 2007–2011
Top patents by PatentIndex Score
5 records- 0192US8598717B2Semiconductor device and method for manufacturing the sameMASUDA NAOMI·Filed 2007·Granted Dec 3, 2013·32 cites·15 claims
- 0277US8637986B2Semiconductor device and method for manufacturing thereofMASUDA NAOMI·Filed 2008·Granted Jan 28, 2014·7 cites·5 claims
- 0366US8486756B2Flip chip bonded semiconductor device with shelf and method of manufacturing thereofMASUDA NAOMI·Filed 2008·Granted Jul 16, 2013·3 cites·18 claims
- 0446US9385014B2Flip-chip package covered with tapeMASUDA NAOMI·Filed 2010·Granted Jul 5, 2016·0 cites·5 claims
- 0546US8446015B2Semiconductor device and method for manufacturing thereofMASUDA NAOMI·Filed 2011·Granted May 21, 2013·0 cites·11 claims
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