Assignee

Lin ding-bo

TW·1 granted patent·0 citations·filing 2012–2012

Technology mixF21K1 F21V1 F21Y1 H10H1 H10W1

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1 record

0122US8633639B2Multichip package structure and light bulb of using the sameLin ding-bo·Filed 2012·Granted Jan 21, 2014·0 cites·9 claims

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