Assignee

LSI LOGIC CORPORTION

US·2 granted patents·81 citations·filing 1995–2005

Technology mixG06F1 H05K1 H10W1

Top patents by PatentIndex Score

2 records

0181US5532516ATechniques for via formation and fillingLSI LOGIC CORPORTION·Filed 1995·Granted Jul 2, 1996·70 cites·4 claims
0272US7480878B2Method and system for layout versus schematic validation of integrated circuit designsLSI LOGIC CORPORTION·Filed 2005·Granted Jan 20, 2009·11 cites·10 claims

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