Assignee
LIN WEI-FENG
TW·2 granted patents·2 pending applications·3 citations·filing 2011–2020
Top patents by PatentIndex Score
4 records- 0169US8665364B2Reinforcement structure for wafer-level camera moduleLIN WEI-FENG·Filed 2011·Granted Mar 4, 2014·3 cites·15 claims
- 0258US11515347B2Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making sameLIN WEI FENG·Filed 2020·Granted Nov 29, 2022·0 cites·9 claims
- 0340US2013258182A1Wafer level camera module with protective tubeLIN WEI-FENG·Filed 2012·Application pending·0 cites
- 0433US2013083229A1Emi shield for camera moduleLIN WEI-FENG·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →