Assignee

LIN PO-YAO

TW·2 granted patents·20 citations·filing 2010–2010

Technology mixH10W2 H01L1 H05K1

Top patents by PatentIndex Score

2 records

0191US8970029B2Thermally enhanced heat spreader for flip chip packagingLIN PO-YAO·Filed 2010·Granted Mar 3, 2015·17 cites·20 claims
0270US8283777B2Compressive ring structure for flip chip packagingLIN PO-YAO·Filed 2010·Granted Oct 9, 2012·3 cites·20 claims

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