Assignee
LIN CHUN-LING
TW·1 granted patent·2 pending applications·0 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0141US9416459B2Electrical chemical plating processLIN CHUN-LING·Filed 2011·Granted Aug 16, 2016·0 cites·20 claims
- 0232US2013178063A1Method of manufacturing semiconductor device having silicon through viaLIN CHUN-LING·Filed 2012·Application pending·0 cites
- 0332US2012270389A1Method for manufacturing interconnection structure and of metal nitride layer thereofLIN CHUN-LING·Filed 2011·Application pending·0 cites
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