Assignee
LILOGIX INC
US·3 granted patents·29 citations·filing 2001–2002
Top patents by PatentIndex Score
3 records- 0163US6651866B2Precision bond head for mounting semiconductor chipsLILOGIX INC·Filed 2001·Granted Nov 25, 2003·15 cites·23 claims
- 0259US6818543B2Process and apparatus for mounting semiconductor components to substrates and parts thereforLILOGIX INC·Filed 2002·Granted Nov 16, 2004·10 cites·21 claims
- 0351US6474710B2Mounting apparatus for electronic partsLILOGIX INC·Filed 2002·Granted Nov 5, 2002·4 cites·11 claims
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