Assignee
LETZ TOBIAS
DE·3 granted patents·11 citations·filing 2007–2010
Top patents by PatentIndex Score
3 records- 0177US8193086B2Local silicidation of via bottoms in metallization systems of semiconductor devicesLETZ TOBIAS·Filed 2009·Granted Jun 5, 2012·8 cites·21 claims
- 0272US8859398B2Enhancing adhesion of interlayer dielectric materials of semiconductor devices by suppressing silicide formation at the substrate edgeLETZ TOBIAS·Filed 2010·Granted Oct 14, 2014·3 cites·29 claims
- 0342US8841140B2Technique for forming a passivation layer without a terminal metalLETZ TOBIAS·Filed 2007·Granted Sep 23, 2014·0 cites·15 claims
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