Assignee
KOSENKO VALENTIN
US·4 granted patents·29 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0191US9018094B2Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substratesKOSENKO VALENTIN·Filed 2011·Granted Apr 28, 2015·15 cites·32 claims
- 0282US8757897B2Optical interposerKOSENKO VALENTIN·Filed 2012·Granted Jun 24, 2014·7 cites·52 claims
- 0380US8431431B2Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layersKOSENKO VALENTIN·Filed 2011·Granted Apr 30, 2013·4 cites·12 claims
- 0470US9323010B2Structures formed using monocrystalline silicon and/or other materials for optical and other applicationsKOSENKO VALENTIN·Filed 2012·Granted Apr 26, 2016·3 cites·13 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →