Assignee
KAWASE TAKEYUKI
JP·3 granted patents·4 pending applications·10 citations·filing 2006–2011
Top patents by PatentIndex Score
7 records- 0179US9474194B2Electronic component mounting systemKAWASE TAKEYUKI·Filed 2011·Granted Oct 18, 2016·5 cites·2 claims
- 0274US8782875B2Component mounting apparatus and substrate conveyance method in component mounting apparatusKAWASE TAKEYUKI·Filed 2010·Granted Jul 22, 2014·4 cites·2 claims
- 0360US8510937B2Component mounting apparatus and substrate conveyance method in component mounting apparatusKAWASE TAKEYUKI·Filed 2010·Granted Aug 20, 2013·1 cites·2 claims
- 0454US2009077106A1Component data distribution method, component data distribution apparatus, and program thereofKAWASE TAKEYUKI·Filed 2007·Application pending·0 cites
- 0545US2009088888A1Component mounting methodKAWASE TAKEYUKI·Filed 2006·Application pending·0 cites
- 0641US2013247370A1Electronic component mounting system and electronic component mounting methodKAWASE TAKEYUKI·Filed 2011·Application pending·0 cites
- 0741US2013247369A1Electronic component mounting system and electronic component mounting methodKAWASE TAKEYUKI·Filed 2011·Application pending·0 cites
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