Assignee
KAWADA YASUO
JP·1 granted patent·3 pending applications·7 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0179US8496767B2Anodic bonding method, anodic bonding jig and anodic bonding apparatusKAWADA YASUO·Filed 2011·Granted Jul 30, 2013·7 cites·5 claims
- 0236US2012228744A1Wafer and method of manufacturing package productKAWADA YASUO·Filed 2012·Application pending·0 cites
- 0335US2012247291A1Bonded glass cutting method, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled time pieceKAWADA YASUO·Filed 2012·Application pending·0 cites
- 0434US2012247658A1Glass body cutting method, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled time pieceKAWADA YASUO·Filed 2012·Application pending·0 cites
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