Assignee
KAWADA HIDEYA
JP·1 granted patent·1 pending application·10 citations·filing 2006–2012
Top patents by PatentIndex Score
2 records- 0173US8220696B2Manufacturing method of printed wiring board and a laminate jointing apparatusKAWADA HIDEYA·Filed 2006·Granted Jul 17, 2012·10 cites·19 claims
- 0244US2012199291A1Manufacturing method of printed wiring board and a laminate jointing apparatusKAWADA HIDEYA·Filed 2012·Application pending·0 cites
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