Assignee
ISHIDA HISASHI
JP·5 granted patents·16 citations·filing 2007–2011
Top patents by PatentIndex Score
5 records- 0178US8106303B2Printed wiring board including a thermal land for supressing heat dissipationISHIDA HISASHI·Filed 2007·Granted Jan 31, 2012·7 cites·11 claims
- 0275US9313877B2Electronic device and noise suppression methodISHIDA HISASHI·Filed 2010·Granted Apr 12, 2016·3 cites·21 claims
- 0362US9027991B2Racing bucket seat and cooling system for racing car with the sameISHIDA HISASHI·Filed 2010·Granted May 12, 2015·6 cites·21 claims
- 0452US8921711B2Wiring substrate and electronic deviceISHIDA HISASHI·Filed 2011·Granted Dec 30, 2014·0 cites·10 claims
- 0548US9320141B2Wiring structure, cable, and method of manufacturing wiring structureISHIDA HISASHI·Filed 2010·Granted Apr 19, 2016·0 cites·19 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →