Assignee
HO CHENG-EN
TW·3 granted patents·1 pending application·5 citations·filing 2008–2012
Top patents by PatentIndex Score
4 records- 0174US8092621B2Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder jointsHO CHENG-EN·Filed 2010·Granted Jan 10, 2012·5 cites·4 claims
- 0245US8207469B2Method for inhibiting electromigration-induced phase segregation in solder jointsHO CHENG-EN·Filed 2008·Granted Jun 26, 2012·0 cites·18 claims
- 0344US8702878B2Method for controlling beta-tin orientation in solder jointsHO CHENG-EN·Filed 2011·Granted Apr 22, 2014·0 cites·2 claims
- 0440US2013153646A1Method for suppressing kirkendall voids formation at the interface between solder and copper padHO CHENG-EN·Filed 2012·Application pending·0 cites
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