Assignee
HASHII TOMOHIRO
JP·2 granted patents·1 pending application·4 citations·filing 2009–2011
Top patents by PatentIndex Score
3 records- 0165US8092277B2Method of grinding semiconductor wafers, grinding surface plate, and grinding deviceHASHII TOMOHIRO·Filed 2009·Granted Jan 10, 2012·4 cites·8 claims
- 0232US2012315739A1Manufacturing method for semiconductor waferHASHII TOMOHIRO·Filed 2011·Application pending·0 cites
- 0331US9550264B2Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor waferHASHII TOMOHIRO·Filed 2010·Granted Jan 24, 2017·0 cites·5 claims
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