Assignee
BONDTECH INC
JP·2 granted patents·1 pending application·21 citations·filing 2004–2005
Top patents by PatentIndex Score
3 records- 0181US7784670B2Joining method and device produced by this method and joining unitBONDTECH INC·Filed 2005·Granted Aug 31, 2010·11 cites·23 claims
- 0260US7645681B2Bonding method, device produced by this method, and bonding deviceBONDTECH INC·Filed 2004·Granted Jan 12, 2010·10 cites·22 claims
- 0332US2007110917A1Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unitBONDTECH INC·Filed 2004·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →