Assignee
ASAI MASAYUKI
JP·3 granted patents·5 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0175US8168549B2Method of manufacturing semiconductor device and substrate processing apparatusASAI MASAYUKI·Filed 2010·Granted May 1, 2012·4 cites·2 claims
- 0261US9175395B2Substrate processing apparatus and semiconductor device manufacturing methodASAI MASAYUKI·Filed 2011·Granted Nov 3, 2015·1 cites·10 claims
- 0341US9545736B2Mold and die metallic material, air-permeable member for mold and die use, and method for manufacturing the sameASAI MASAYUKI·Filed 2012·Granted Jan 17, 2017·0 cites·15 claims
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