Assignee
ARAI HIDETA
JP·4 granted patents·1 pending application·15 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0190US9060431B2Liquid crystal polymer copper-clad laminate and copper foil used for said laminateARAI HIDETA·Filed 2012·Granted Jun 16, 2015·7 cites·34 claims
- 0278US8524378B2Copper foil for printed circuitARAI HIDETA·Filed 2009·Granted Sep 3, 2013·8 cites·11 claims
- 0360US9049795B2Rolled copper or copper-alloy foil provided with roughened surfaceARAI HIDETA·Filed 2012·Granted Jun 2, 2015·0 cites·17 claims
- 0452US9580829B2Copper foil for printed circuitARAI HIDETA·Filed 2011·Granted Feb 28, 2017·0 cites·20 claims
- 0544US2014057123A1Copper foil for printed circuitARAI HIDETA·Filed 2012·Application pending·0 cites
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